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Mesoscale Parts Fabrication

As microelectromechanical systems (MEMS) find more applications in everyday products, the need to make small mechanical parts on the mesoscale level increases. Although silicon was a traditional material used in the past to make these devices, different materials are often required, due to cost and environmental reasons. The SF-100 has found many different uses in these applications, providing rapid prototyping of new and unique mesoscale parts. Some of these devices are shown below.


Micro gears have been made as base components for sensor systems that utilize these mechanical parts in their design. Examples of patterned copper (left) and completely fabricated gears (center and right) are shown.


Flexible microheaters have been fabricated using the SF-100 for patterning of these high density devices. The above photo is a demonstration of a microheater made from copper lines. The flexible substrate is liquid crystal polymer (LCP) material. The entire heater is shown on the left, while a high resolution image of the heater coil and bond pads are shown on the right.


Another microheater design is shown above. Again, copper clad LCP is the starting material. The copper is then patterned and etched to provide the simple heater assembly. After patterning, the copper is then coated with a thin layer of tin, for chemical compatibility of the heater with its environment. The complete device is shown on the left, while a high resolution image of the heater elements is on the right.


The above pressure sensor was fabricated using teflon as the substrate. This substrate was then plated with tin, photoresist patterned on the SF-100, wet etched to form the active areas of the device, and then the photoresist is removed. The dark areas are discolored teflon, which is formed as a result of the etchant used. Various magnified views of the device are shown.


3 dimensional mechanical microsprings have been fabricated using the SF-100. A copper base material is used to start and then the spring is formed by performing photolithography on the SF-100 and integrating subsequant wet etch processes.

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